Toshiba Digital Camera TLP848 User Manual

TLP848  
TOSHIBA Photointerrupter Infrared LED + Phototransistor  
TLP848  
Camera Module for Mobile Phone  
Digital Still Camera and Video Camera  
Personal Equipment and Small-sized OA Equipment  
The TLP848 is a surface-mount photointerrupter which is composed of a  
GaAs infrared LED and a Si phototransistor.  
It is an ultra compact package. Moreover it has a wider gap width than  
1mm gap width of industry-standard and has a high resolution.  
Ultra compact package : 2.8×1.9×2.5mm (typ.)  
Surface-mount type  
Lead(Pb)-Free  
Gap width : 1.2mm (typ.)  
High resolution : Slit width 0.3 mm (typ.)  
TOSHIBA  
11-3B1  
High current transfer ratio : I /I = 3% (min)  
C F  
Material of the package : PPS (Polyphenylene sulfide)  
(UL94V-0)  
Weight: 0.017 g (typ.)  
Absolute Maximum Ratings (Ta = 25°C)  
Marking (Note 2)  
Characteristics  
Forward current  
Symbol  
Rating  
Unit  
Weekly Code  
I
30  
0.33  
5
mA  
mA/°C  
V
F
Forward current derating (Ta>25°C)  
Reverse voltage  
ΔI °C  
F/  
V
R
Collector-emitter voltage  
Emitter-collector voltage  
Collector power dissipation  
V
15  
V
CEO  
ECO  
V
5
V
P
75  
mW  
C
Collector power dissipation derating  
ΔP °C  
C/  
1  
mW/°C  
(Ta>25)  
Collector current  
I
50  
mA  
°C  
°C  
°C  
C
Operating temperature range  
Storage temperature range  
T
opr  
30 to 85  
40 to 100  
250  
T
stg  
sol  
Soldering temperature  
(Note 1)  
T
Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the  
significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even  
if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum  
ratings.  
Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook  
(“Handling Precautions”/“Derating Concept and Methods”) and individual reliability data (i.e. reliability test  
report and estimated failure rate, etc).  
Note 1: The reflow time and the example of temperature profile are shown in the section entitled Mounting Method.  
Note 2: Weekly code: (Three digits)  
Week of manufacture  
(01 for first week of year, continues up to 52 or 53)  
Year of manufacture  
(One low-order digits of calendar year)  
1
2007-10-01  
 
TLP848  
Package Dimensions: TOSHIBA 11-3B1  
Unit: mm  
Tolerance : ±0.1mm unless otherwise specified  
): Reference value  
(
Gate position  
Center of sensor  
Weight: 0.017 g (typ.)  
Pin Connection  
1: Cathode  
2
1
3
4
2: Anode  
3: Collector  
4: Emitter  
3
2007-10-01  
 
TLP848  
Handling and Mounting Precautions  
Care must be taken in relation to the environment in which the device is to be installed. Oil or chemicals  
may cause the package to melt or crack.  
The device should be mounted on an unwarped surface.  
Do not apply stress to the resin at high temperature.  
The resin part is easily scratched, so avoid friction with hard materials.  
When installing the assembly board in equipment, ensure that this product does not come into contact with  
other components.  
Conversion efficiency falls over time due to the current which flows in the infrared LED. When designing a  
circuit, take into account this change in conversion efficiency over time. The ratio of fluctuation in  
conversion efficiency to fluctuation in infrared LED optical output is 1:1.  
I /I  
I /I  
C F (0)  
P
P
C F (t)  
o (t)  
=
o (0)  
Moisture-Proof Packing  
To avoid moisture absorption, the reel is packed in an aluminum bag that contains a desiccant with a  
humidity indicator. Since the optical characteristics of the photointerrputer may be affected during soldering  
by vaporization of the moisture which is absorbed in storable period, it should be stored under the following  
conditions:  
1. If the aluminum bag has been stored unopened  
Temperature: 5 to 30°C  
Relative humidity: 90% RH (max)  
Time: 12 months  
2. If the aluminum bag has been opened  
Temperature: 5 to 30°C  
Relative humidity: 70% RH (max)  
Time: 168 h  
3. Baking should be conducted within 72 h after the humidity indicator shows > 30% or the bag seal date  
is over 12 months. The number of baking should be once. If the baking is conducted repeatedly, it may  
affect the peel-back force and cause a problem for mounting.  
Baking condition: 60 ± 5°C, 12 to 24 h  
Storage period: 12 months from the seal date on the label  
4. When the photointerrupter is baked, protect it from electrostatic discharge.  
5. Do not toss or drop to avoid damaging the moisture-proof bag.  
4
2007-10-01  
 
TLP848  
Mounting Methods  
1. The example of temperature profile (reflow soldering)  
10 s max (*)  
250°C max (*)  
230°C  
4°C/s max (*)  
180°C  
160°C  
3050 s  
60120 s  
4°C/s max (*)  
Time (s)  
(*)The product is evaluated using above reflow soldering conditions. No additional test is performed  
exceed the condition (i.e. the condition more than MAX values) as an evaluation.  
Please perform reflow soldering under the above conditions.  
The first reflow process should be performed under the above temperature profile within 168 h  
after opening the bag.  
If a second reflow process needs to be performed, it should be performed within 168 h of the first  
reflow under the above temperature profile.  
Storage conditions before the second reflow process: 30°C, 70% RH (max)  
Do not perform wave soldering and manual soldering with a soldering iron.  
2. Recommended soldering pattern  
Unit: mm  
1.0  
1.5  
3. Cleaning  
When cleaning is required after soldering, Toshiba recommends the following cleaning solvents.  
It is confirmed that these solvents have no effect on semiconductor devices in our dipping test  
(under the recommended conditions).  
In selecting the one for your actual usage, please perform sufficient review on washing condition,  
using condition and etc.  
ASAHI CLEAN AK-225AES  
KAO CLEAN TROUGH 750H  
PINE ALPHA ST-100S  
TOSHIBA TECHNOCARE  
(FRW-17, FRW-1, FRV-100)  
: (made by ASAHI GLASS)  
: (made by KAO)  
: (made by ARAKAWA CHEMICAL)  
: (made by GE TOSHIBA SILICONES)  
5
2007-10-01  
 
TLP848  
Packing Specification  
1. Tape dimensions  
Unit: mm  
4.0±0.1  
0.1  
φ1.5 +−  
0
2.0±0.05  
0.3±0.05  
B'  
B'  
A
A'  
B
2.7±0.1  
B
φ1.1±0.1  
4.0±0.1  
2.1±0.1  
max 5°  
max 5°  
A'  
A
Device direction  
6
2007-10-01  
 
TLP848  
2. Reel dimensions  
Unit: mm  
+0  
4  
φ180  
11.4 ± 1  
9 ± 0.3  
φ21 ± 0.8  
φ13 ± 0.5  
2 ± 0.5  
3. Leader and trailer sections of tape  
100 mm or more  
(Note 2)  
160 mm or more  
(Note 1)  
Leading part: 400 mm or more  
Note1: Empty trailer section  
Note2: Empty leader section  
7
2007-10-01  
 
TLP848  
4. Packing format  
(1) Packing quantity  
Reel  
1,500 pcs  
7,500 pcs  
Carton  
(2) Packing form  
Each reel is sealed in an aluminum bag that contains a desiccant with a humidity indicator.  
8
2007-10-01  
 
TLP848  
P
Ta  
I
Ta  
C
F
80  
60  
40  
20  
0
35  
30  
25  
20  
15  
10  
5
0
0
20  
40  
60  
80  
100  
0
20  
40  
60  
80  
100  
Ambient temperature Ta (°C)  
Ambient temperature Ta (°C)  
I
– V  
(typ.)  
I
/ I – I  
F F  
F
F
C
100  
10  
1
100  
10  
1
Ta = 25°C  
V
= 2V  
CE  
CE  
V
= 0.4V  
Sample 2  
Sample 1  
Ta = 75°C  
50  
25  
0
25  
0.9  
1
1.1  
1.2  
1.3  
1.4  
1.5  
1
10  
100  
Forward voltage  
V
F
(V)  
Forward current  
I
F
(mA)  
I
C
– I  
F
I
– V  
(typ.)  
C
CE  
10  
4
Ta = 25°C  
Ta = 25°C  
20  
15  
V
= 2V  
CE  
3.5  
3
V
= 0.4V  
CE  
Sample 2  
1
2.5  
2
Sample 1  
10  
1.5  
1
0.1  
I
= 5mA  
F
0.5  
0
0.01  
1
10  
100  
0
2
4
6
8
10  
12  
Forward current  
I
F
(mA)  
Collector-emitter voltage  
V
(V)  
CE  
9
2007-10-01  
 
TLP848  
I
(I ) Ta  
CEO  
(typ.)  
Relative I Ta  
(typ.)  
D
C
100  
10  
1.2  
1
V
= 12V  
CE  
0.8  
0.6  
0.4  
0.2  
1
0.1  
V
= 2V  
CE  
I
F
I
F
I
F
= 20mA  
= 10mA  
= 5mA  
0.01  
-40  
-20  
0
20  
40  
60  
80  
100  
0.001  
0.0001  
0.00001  
Ambient temperature Ta (°C)  
0
20  
40  
60  
80  
100  
120  
V
Ta  
(typ.)  
CE (sat)  
0.20  
0.16  
0.12  
0.08  
0.04  
0.00  
Ambient temperature Ta (°C)  
I
I
= 0.15mA  
= 10mA  
C
F
-40  
-20  
0
20  
40  
60  
80  
100  
Ambient temperature Ta (°C)  
Switching characteristics  
(non saturated operation) (typ.)  
Switching characteristics  
(saturated operation)  
(typ.)  
1000  
100  
10  
1000  
100  
10  
Ta = 25°C  
Ta = 25°C  
t
t
f
r,  
t
f
I
= 20mA  
= 5V  
V
V
= 5V  
F
CC  
V
V
= 1V  
CC  
OUT  
4.65V  
OUT  
t
t
d
s
t
s
t
r
1
t
d
0.1  
1
0.1  
1
10  
100  
1
10  
100  
Load resistance  
R
L
(kΩ)  
Load resistance  
R
L
(kΩ)  
10  
2007-10-01  
 
TLP848  
Detection position  
characteristics (2)  
Detection position  
characteristics (1)  
(typ.)  
(typ.)  
1.2  
1
1.2  
1
I
= 5mA  
= 2V  
I
= 5mA  
= 2V  
F
F
V
V
CE  
CE  
Ta = 25°C  
Ta = 25°C  
+
0
0.8  
0.6  
0.4  
0.2  
0
0.8  
0.6  
0.4  
0.2  
0
Shutter  
d
d
Shutter  
Detection position  
+0.6  
Detection position  
d = 0 ± 0.2mm  
d = 0.75  
mm  
-0.5  
-2  
-1  
0
1
2
3
4
-1.2  
-0.8  
-0.4  
0
0.4  
0.8  
1.2  
Distance  
d
(mm)  
Distance  
d
(mm)  
Relative Positioning of Shutter and Device  
For normal operation, position the shutter and the device as shown in the figure below. By considering the  
device's detection direction characteristic and switching time, determine the shutter slit width and pitch.  
Shutter  
A
A’  
Unit: mm  
Center of sensor  
Cross section between A and A'  
11  
2007-10-01  
 
TLP848  
RESTRICTIONS ON PRODUCT USE  
20070701-EN  
The information contained herein is subject to change without notice.  
TOSHIBA is continually working to improve the quality and reliability of its products. Nevertheless, semiconductor  
devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical  
stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to comply with the standards of  
safety in making a safe design for the entire system, and to avoid situations in which a malfunction or failure of  
such TOSHIBA products could cause loss of human life, bodily injury or damage to property.  
In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as  
set forth in the most recent TOSHIBA products specifications. Also, please keep in mind the precautions and  
conditions set forth in the “Handling Guide for Semiconductor Devices,” or “TOSHIBA Semiconductor Reliability  
Handbook” etc.  
The TOSHIBA products listed in this document are intended for usage in general electronics applications  
(computer, personal equipment, office equipment, measuring equipment, industrial robotics, domestic appliances,  
etc.).These TOSHIBA products are neither intended nor warranted for usage in equipment that requires  
extraordinarily high quality and/or reliability or a malfunction or failure of which may cause loss of human life or  
bodily injury (“Unintended Usage”). Unintended Usage include atomic energy control instruments, airplane or  
spaceship instruments, transportation instruments, traffic signal instruments, combustion control instruments,  
medical instruments, all types of safety devices, etc.. Unintended Usage of TOSHIBA products listed in his  
document shall be made at the customer’s own risk.  
The products described in this document shall not be used or embedded to any downstream products of which  
manufacture, use and/or sale are prohibited under any applicable laws and regulations.  
The information contained herein is presented only as a guide for the applications of our products. No  
responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which  
may result from its use. No license is granted by implication or otherwise under any patents or other rights of  
TOSHIBA or the third parties.  
GaAs(Gallium Arsenide) is used in this product. The dust or vapor is harmful to the human body. Do not break,  
cut, crush or dissolve chemically.  
Please contact your sales representative for product-by-product details in this document regarding RoHS  
compatibility. Please use these products in this document in compliance with all applicable laws and regulations  
that regulate the inclusion or use of controlled substances. Toshiba assumes no liability for damage or losses  
occurring as a result of noncompliance with applicable laws and regulations.  
12  
2007-10-01  
 

Tripp Lite Headphones SP5000USB User Manual
Tripp Lite Surge Protector 200204173 User Manual
Turbo Chef Technologies Oven NGC 1007 User Manual
Uniden Cordless Telephone EXI 7926 User Manual
Uniflame Gas Grill GBC983W C User Manual
Unigreen Humidifier LASER FUTURA EXPO series AT STD TOP AT BASE User Manual
Viking Oven VEDO530 User Manual
Vornado Electric Heater AVH10 User Manual
Vulcan Hart Oven VULCAN 36IRB User Manual
Walker Indoor Furnishings V60Y712B User Manual